发明名称 |
COPPER WIRING STRUCTURE FORMING METHOD |
摘要 |
In a Cu wiring structure forming method, a barrier film serving as a Cu diffusion barrier is formed at least on a surface of a recess in a first insulating film formed on a substrate, and the recess is filled with an Al-containing Cu film. A Cu wiring is formed from the Al-containing Cu film, and a cap layer including a Ru film is formed on the Cu wiring. Further, an interface layer containing a Ru—Al alloy is formed at an interface between the Cu wiring and the cap layer by heat generated in forming the cap layer or by a heat treatment performed after forming the cap layer. A second insulating film is formed on the cap layer. |
申请公布号 |
US2015056385(A1) |
申请公布日期 |
2015.02.26 |
申请号 |
US201414464684 |
申请日期 |
2014.08.20 |
申请人 |
Tokyo Electron Limited |
发明人 |
ISHIZAKA Tadahiro;SUZUKI Kenji |
分类号 |
H05K3/10;H05K3/00 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
1. A Cu wiring structure forming method, comprising:
providing a first insulating film having a recess on a substrate; forming a barrier film serving as a Cu diffusion barrier at least on a surface of the recess of the first insulating film on a substrate; filling the recess with an Al-containing Cu film; forming a Cu wiring from the Al-containing Cu film; forming a cap layer including a Ru film on the Cu wiring; forming an interface layer containing a Ru—Al alloy at an interface between the Cu wiring and the cap layer by heat generated in forming the cap layer or by a heat treatment performed after forming the cap layer; and forming a second insulating film on the cap layer. |
地址 |
Tokyo JP |