| 发明名称 |
SOLID STATE RELAY |
| 摘要 |
A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A subminiature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device. |
| 申请公布号 |
US2015054356(A1) |
申请公布日期 |
2015.02.26 |
| 申请号 |
US201414217179 |
申请日期 |
2014.03.17 |
| 申请人 |
Zonit Structured Solutions, LLC |
发明人 |
Chapel Steve;Pachoud William |
| 分类号 |
H05K1/02;H05K7/20;H05K3/30;H03K17/687;H03K17/13;H05K1/18;H05K5/00 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A relay, comprising:
a relay, implemented on a printed circuit board, operative for switching power between a first contact associate with a first circuit and a second contact; housing structure for at least partially enclosing said relay; multiple heat sink elements for dissipating heat generated by said relay in operation; and a fan positioned for producing an air flow across said heat sink elements. |
| 地址 |
Boulder CO US |
