| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which achieves high heat dissipation performance and low manufacturing cost; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device manufacturing method according to an embodiment comprises: a process of forming a plurality of intermediate structures each including an electrode formed on a semiconductor member and having an upper part shape and a lower part shape which are different from each other when viewed from above; a process of arranging the plurality of intermediate structures in a spaced manner on a tray where a plurality of recesses to which the one part between the upper part and the lower part is fitted and the other is not fitted are formed on an upper surface, by rolling the plurality of intermediate structures and fitting the one part of each intermediate structure to the recess; and a process of forming an external electrode which is connected to the electrode and a part of which extends outward from the intermediate structure when viewed from above. |
