发明名称 SOUNDPROOF HOUSING FOR EARSET AND WIRED AND WIRELESS EARSET COMPRISING SAME
摘要 The present invention provides a soundproof housing for an earset, comprising: a housing main body, coupled to the inside of a front surface case having a protrusion portion inserted into the ear, and provided with a speaker accommodation groove and a microphone accommodation groove; a speaker output hole, penetratingly formed in the speaker accommodation groove so as to communicate with the front surface case, and adjacent to the output end of the speaker; and a microphone input hole, formed in a recessed manner inside the microphone accommodation groove so as to communicate with the front surface case, and adjacent to the input end of the microphone, wherein the housing main body is protrudingly formed as a long protrusion toward the inside of the protrusion portion of the front surface case, so as to be tightly coupled with the inside of the protrusion portion of the front surface case.
申请公布号 US2015055810(A1) 申请公布日期 2015.02.26
申请号 US201214388386 申请日期 2012.11.09
申请人 HAEBORA 发明人 Shin Doo Sik
分类号 H04R1/10;H04R1/02 主分类号 H04R1/10
代理机构 代理人
主权项 1. A soundproof housing for an earset, the housing comprising: a housing main body coupled with the inside of a front surface case having a case body and a protrusion portion extended from the case body and inserted into the ear, and provided with a speaker accommodation groove for accommodating a speaker and a microphone accommodation groove for accommodating a microphone; a speaker output hole penetratingly formed in the speaker accommodation groove so as to communicate with the front surface case and adjacent to an output end of the speaker; and a microphone input hole penetratingly formed in the microphone accommodation groove so as to communicate with the front surface case and adjacent to an input end of the microphone, wherein the housing main body protrudes toward the inside of a protrusion portion of the front surface case so as to be tightly coupled with the inside of a protrusion portion of the front surface case.
地址 Seoul KR
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