| 发明名称 |
ABRASIVE SLICING TOOL FOR ELECTRONICS INDUSTRY |
| 摘要 |
A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations. |
| 申请公布号 |
US2015052821(A1) |
申请公布日期 |
2015.02.26 |
| 申请号 |
US201414533178 |
申请日期 |
2014.11.05 |
| 申请人 |
Saint-Gobain Abrasives, Inc. ;Saint-Gobain Abrasifs |
发明人 |
Walia Parul;Ramanath Srinivasan;Hall Richard W. J. |
| 分类号 |
B24D3/06 |
主分类号 |
B24D3/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for producing a metal bonded abrasive tool, the method comprising:
a. combining abrasive grains and a metal bond composition including nickel, tin metal and a pre-alloyed bronze; b. forming the combined abrasive grains and metal bond composition into a shaped body; and c. densifying the shaped body to produce the metal bonded abrasive tool, wherein the metal bonded abrasive tool has less than 20% porosity. |
| 地址 |
Worcester MA US |
