| 摘要 |
<p>A semiconductor processing assembly (100) comprising a first and a second semiconductor processing system (110a, 110b), wherein each semiconductor processing system includes a primary body (120) that extends in a longitudinal direction (L) from a front end (122) to a rear end (124) and includes a first and a second lateral side (126, 132) extending therebetween, wherein the primary bodies (120) of the semiconductor processing systems (110a, 110b) are placed next to each other, such that the first lateral side (126a) of the primary body (120a) of the first semiconductor processing system (110a) opposes the first lateral side (126b) of the primary body (120b) of the second semiconductor processing system (110b), and wherein the opposing first lateral sides (126a, 126b) at least partially diverge, as seen in the longitudinal direction (L), to form a longitudinally extending maintenance space (200) between them.</p> |
