发明名称 |
HIGH-POWER ELECTRONIC DEVICES CONTAINING METAL NANOPARTICLE-BASED THERMAL INTERFACE MATERIALS AND RELATED METHODS |
摘要 |
High-power electronic components generate significant amounts of heat that must be removed in the course of normal device operations. Certain types of electronic components, such as some monolithic microwave integrated circuits and LEDs, can contain materials that are difficult to effectively bond to a heat gink in order to establish a thermal interface between the two. Device assemblies can include a heat-generating electronic component in thermal communication with a metallic heat sink via a metallic thermal interface layer. The metallic thermal interface layer is disposed between the heat-generating electronic component and the metallic heat sink. The metallic thermal interface layer is formed from a composition including a plurality of metal nanoparticles that are at least partially fused together with one another. Methods for forming a thermal interface layer include heating metal nanoparticles above their fusion temperature and subsequently cooling the liquefied metal nanoparticles to promote bonding of the electronic component. |
申请公布号 |
US2015054020(A1) |
申请公布日期 |
2015.02.26 |
申请号 |
US201414466938 |
申请日期 |
2014.08.22 |
申请人 |
LOCKHEED MARTIN CORPORATION |
发明人 |
PAOLELLA Arthur;Winter Adam Theron;Degler David S.;Zinn Alfred A.;Ermer Susan Patricia |
分类号 |
H01L23/373;H01L33/00;H01L21/48;H01L33/64 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
1. A device assembly comprising:
a heat-generating electronic component in thermal communication with a metallic heat sink via a metallic thermal interface layer, the metallic thermal interface layer being disposed between the heat-generating electronic component and the metallic heat sink and the metallic thermal interface layer being formed from a composition comprising a plurality of metal nanoparticles that are at least partially fused together with one another. |
地址 |
Bethesda MD US |