| 发明名称 |
POLISHING COMPOSITION |
| 摘要 |
The polishing composition of the present invention is a polishing composition for polishing a tungsten-containing metal layer formed on an insulating layer, the polishing composition comprising: abrasive grains; one or more halogen acids selected from the group consisting of iodic acid, iodous acid, and hypoiodous acid; a strong acid; a hydrogen-ion-supplying agent; and water. |
| 申请公布号 |
US2015053887(A1) |
申请公布日期 |
2015.02.26 |
| 申请号 |
US201314359357 |
申请日期 |
2013.03.28 |
| 申请人 |
NITTA HAAS INCORPORATED |
发明人 |
Hosokawa Koichiro;Ota Yoshiharu;Yoshida Shoichiro |
| 分类号 |
C09G1/02 |
主分类号 |
C09G1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polishing composition for polishing a tungsten-containing metal layer formed on an insulating layer, the polishing composition comprising:
abrasive grains; one or more halogen acids selected from the group consisting of iodic acid, iodous acid, and hypoiodous acid; a strong acid; a hydrogen-ion-supplying agent; and water. |
| 地址 |
Osaka JP |
