发明名称 Detection of defects embedded in noise for inspection in semiconductor manufacturing
摘要 <p>One embodiment relates to an apparatus for detecting defects on a manufactured substrate. The apparatus includes an imaging tool arranged to obtain image frames from the manufactured substrate. The apparatus further includes a data processing system which includes computer-readable code configured to compute features for pixels in an image frame and divide the pixels in the image frame into feature-defined groups of pixels. The computer-readable code is further configured to select a feature-defined group, and generate a multi-dimensional feature distribution for the selected feature-defined group. Another embodiment relates to a method of detecting defects from a test images frame and multiple reference image frames. Other embodiments, aspects, and features are also disclosed.</p>
申请公布号 IL236402(D0) 申请公布日期 2015.02.26
申请号 IL20140236402 申请日期 2014.12.23
申请人 KLA-TENCOR CORPORATION 发明人
分类号 H01L 主分类号 H01L
代理机构 代理人
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