发明名称 |
IMPLANT ENCAPSULATION |
摘要 |
An implant unit may include a substrate and an implantable circuit arranged on the substrate. An encapsulation structure may be disposed over at least a portion of the substrate and at least a portion of the implantable circuit, the encapsulation structure including a parylene layer and a silicon layer disposed over the parylene layer. |
申请公布号 |
US2015057727(A1) |
申请公布日期 |
2015.02.26 |
申请号 |
US201414476715 |
申请日期 |
2014.09.03 |
申请人 |
Mashiach Adi;Maschiach Yitzik |
发明人 |
Mashiach Adi;Maschiach Yitzik |
分类号 |
A61N1/375;A61N1/36;A61N1/372 |
主分类号 |
A61N1/375 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Tel Aviv IL |