| 发明名称 |
LOW-CURRENT FUSE STAMPING METHOD |
| 摘要 |
A convenient, cost-effective method for manufacturing low-current fuse elements. The method may include the steps of stamping a substrate out of a sheet of material and stamping at least one hole in the substrate. The method may further include the steps of bonding a layer of fuse material to a surface of the substrate with a portion of the fuse material covering the hole, stamping a fuse element out of the portion of fuse material covering the hole, and separating an individual fuse from the fuse material and the substrate. A low-current fuse can thereby be obtained using an easily performed stamping process. |
| 申请公布号 |
US2015054615(A1) |
申请公布日期 |
2015.02.26 |
| 申请号 |
US201314381701 |
申请日期 |
2013.05.16 |
| 申请人 |
LITTELFUSE, INC. |
发明人 |
Beckert James J.;Stumpo Gregory G.;Shierry Stephen R. |
| 分类号 |
H01H69/02;H01H85/06;H01H85/08;H01H85/50 |
主分类号 |
H01H69/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a fuse comprising:
stamping a substrate out of a sheet of material; stamping at least one hole in the substrate; bonding a conductive foil to a surface of the substrate with a portion of the conductive foil covering the at least one hole; stamping a fuse element out of the portion of the conductive foil covering the at least one hole; and separating an individual fuse from the conductive foil and the substrate. |
| 地址 |
Chicago IL US |
