ELECTRONIC CIRCUIT UNIT AND METHOD OF MANUFACTURING ELECTRONIC CIRCUIT UNIT

摘要

An electronic circuit unit includes a circuit substrate having a rectangular shape and is obtained by cutting an integral substrate along a vertical cut line and a horizontal cut line to be separated; a copper foil land soldered to components; and a substrate outer edge, which is formed by cutting, of two sides orthogonal to each other. The copper foil land and the substrate outer edge are positioned in the vicinity of a corner of the circuit substrate. Solder resist is provided around the copper foil land. A plurality of substrate exposure portions without the solder resist is provided in the vicinity of the substrate outer edge.

主权项

1. An electronic circuit unit comprising:
a rectangular-shaped circuit substrate obtained by cutting an integral substrate along a vertical cut line and a horizontal cut line, a corner portion of the circuit substrate being formed between two substrate outer edges orthogonal to each other, the substrate outer edges being formed by the cutting; a copper foil land for a component to be soldered thereto, the copper foil land being disposed in the corner portion of the circuit substrate; a solder resist provided in the corner portion around the copper foil land; a plurality of substrate exposure portions provided in the corner portion along each of the substrate outer edges, the substrate exposure portions lacking the solder resist and exposing a surface of the substrate.