发明名称 |
COIL SEGMENT MANUFACTURING APPARATUS AND COIL SEGMENT MANUFACTURING METHOD |
摘要 |
A coil segment manufacturing apparatus includes a conducting wire material feeder which repeatedly feeds a conducting wire material while changing the feeding amount and interposing a processing time, a coating remover which removes an insulation coating of the conducting wire material at a removal position each time the processing time is reached, and a conducting wire material cutter which cuts the conducting wire material each time the processing time is reached. |
申请公布号 |
US2015052736(A1) |
申请公布日期 |
2015.02.26 |
申请号 |
US201414465381 |
申请日期 |
2014.08.21 |
申请人 |
HONDA MOTOR CO., LTD. |
发明人 |
Hayashi Kanomi;Kawano Shinichi;Ueno Daisuke;Saito Satoru |
分类号 |
H02K15/04 |
主分类号 |
H02K15/04 |
代理机构 |
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代理人 |
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主权项 |
1. A coil segment manufacturing apparatus for manufacturing coil segments in which insulation coatings of both ends have been removed and which have a plurality of different lengths, from a coil conducting wire material provided with an insulation coating, comprising:
a conducting wire material feeder which repeats a feeding operation to feed the conducting wire material by a predetermined feeding amount along a certain feeding route while sequentially changing the feeding amount to a plurality of different feeding amounts corresponding to the plurality of different lengths for each feeding operation and also interposing a predetermined processing time between the feeding operations; a coating remover which removes the insulation coating of the conducting wire material at a removal position on the feeding route within the processing time each time the processing time is reached; a conducting wire material cutter which cuts the conducting wire material at a cutting position on the feeding route within the processing time each time the processing time is reached; and a removal position changer which changes the removal position in synchronization with a change of the feeding amount such that the insulation coating is removed at a portion that includes the position at which the cutting of the conducting wire material is carried out. |
地址 |
TOKYO JP |