| 摘要 |
<p> Provided is an organic semiconductor device of simplified structure without an interlayer insulating film. This organic semiconductor device is provided with: an electrode foil including at least a metal foil; an organic semiconductor layer partially provided on the surface of the electrode foil; an upper electrode layer provided on the organic semiconductor layer; a sealing layer provided on the electrode foil, the organic semiconductor layer, and the upper electrode layer, the sealing layer covering the exposed portions of the electrode foil, the organic semiconductor layer and the upper electrode layer; and at least one contact hole provided so as to pass through the sealing layer, the contact hole enabling electrical connectivity with the upper electrode layer.</p> |
