| 摘要 |
<p>Provided is a substrate treatment apparatus. The provided substrate treatment apparatus comprises: a housing; a liquid supply unit positioned in the housing supplying a liquid to a substrate; and a transfer unit installed in the housing transferring the substrate in a first direction, wherein the transfer unit may include a plurality of shafts arranged in parallel along the first direction being able to be rotated, rollers installed in the outer surfaces of the respective shafts rotated along with the shafts and touching the substrate, measurement members installed in a first point and a second point in the housing measuring the transfer time of the substrate from the first point to the second point, and a controller receiving measurement values from the measurement members controlling the transfer speed of the substrate based on the measurement values. According to the present invention, the substrate treatment apparatus is capable of regularly securing a liquid contact time, and is capable of regularly etching each of the substrates.</p> |
