发明名称 SEMICONDUCTOR LAMINATE AND METHOD FOR MANUFACTURING SAME, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, DOPANT COMPOSITION, DOPANT INJECTION LAYER, AND METHOD FOR FORMING DOPED LAYER
摘要 The present invention provides a method for producing a semiconductor laminate including a substrate having formed thereon a silicon layer with small surface unevenness and high continuity. The method of the present invention for producing a semiconductor laminate having a substrate 10 and a sintered silicon particle layer 5 on the substrate includes (a) coating a silicon particle dispersion containing a dispersion medium and silicon particles dispersed in the dispersion medium, on a substrate 10 to form a silicon particle dispersion layer 1, (b) drying the silicon particle dispersion layer 1 to form a green silicon particle layer 2, (c) stacking a light-transmitting layer 3 on the green silicon particle layer, and (d) irradiating the green silicon particle layer 2 with light through the light-transmitting layer 3 to sinter the silicon particles constituting the green silicon particle layer 2, and thereby form a sintered silicon particle layer 5.
申请公布号 US2015053263(A1) 申请公布日期 2015.02.26
申请号 US201314389187 申请日期 2013.03.29
申请人 TEIJIN LIMITED 发明人 Imamura Tetsuya;Tomizawa Yuka;Ikeda Yoshinori
分类号 H01L21/02;H01L31/0216;H01L29/66;H01L31/20;H01L29/786 主分类号 H01L21/02
代理机构 代理人
主权项
地址 Osaka-shi, Osaka JP