| 摘要 |
The present invention relates to a multilayer structured hybrid coupler. More particularly, a microstrip transition transmission line is formed on the front and rear sides of the hybrid coupler. A circuit of a multilayer structure is formed to connect the transmission lines of the different layers through a vertical transition by installing a via on the microstrip transition transmission line. Multiple vias are installed on the microstrip transition transmission line. Accordingly, the present invention remarkably reduces the size of the hybrid coupler to convert a λ/4 transmission line used for the hybrid coupler to a λ/8 transmission line by forming an ultra-high frequency circuit of a multilayer structure by connecting the transmission lines of the different layers through the vertical transition using the via after the microstrip transmission line is formed with the multilayer structure. |
