| 摘要 |
PROBLEM TO BE SOLVED: To connect electronic components at a predetermined gap with high reliability.SOLUTION: On a top surface 10a of a lower electronic component 10, a spacer 13 is provided, which has an outer surface 13a facing obliquely upward of the top surface 10a; on an undersurface 20a of an upper electronic component 20, a spacer 23 is provided, which has an inner surface 23a facing obliquely downward of the undersurface 20a and is arranged opposite to the outer surface 13a of the spacer 13. The electronic component 10 provided with the spacer 10 and the electronic component 20 provided with the spacer 23 are electrically connected by interposing solder bumps 30 therebetween and arranging the outer surface 13a of the spacer 13 and the inner surface 23a of the spacer 23 opposite to each other, and then melting to solidify the solder bumps 30. |
