发明名称 VARIABLE FREQUENCY MICROWAVE (VFM) PROCESSES AND APPLICATIONS IN SEMICONDUCTOR THIN FILM FABRICATIONS
摘要 Methods and apparatus for processing a substrate are described herein. A vacuum multi-chamber deposition tool can include a degas chamber with both a heating mechanism and a variable frequency microwave source. The methods described herein use variable frequency microwave radiation to increased quality and speed of the degas process without damaging the various components.
申请公布号 US2015056819(A1) 申请公布日期 2015.02.26
申请号 US201414322484 申请日期 2014.07.02
申请人 Applied Materials, Inc. 发明人 WONG Loke Yuen;CHANG Ke;OW Yueh Sheng;JUPUDI Ananthkrishna;MORI Glen T.;KITOWSKI Aksel;BARMAN Arkajit Roy
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method for processing a substrate, comprising: positioning a substrate in a processing chamber, the substrate comprising a first surface; depositing an uncured layer comprising a polymer, an epoxy or combinations thereof over the first surface of the substrate; and performing a hard-cure of the uncured layer, the hard-cure comprising: heating at least the uncured layer to a hard-cure temperature;setting the processing chamber to a hard-cure pressure, the hard-cure pressure being under 100 mTorr;directing a source of microwave radiation toward the uncured layer, the source of microwave radiation producing microwave radiation at a frequency selected from a frequency range of less than 7 GHz; anddelivering the microwave radiation at a variable frequency from the source of microwave radiation to the uncured layer to produce a cured layer, the variable frequency comprising two or more frequencies selected from the frequency range, the variable frequency changing over a period of time.
地址 Santa Clara CA US