| 发明名称 |
ELECTRONIC DEVICE |
| 摘要 |
An electronic device includes a surface-mounted component and a mounting component on which the surface-mounted component is mounted, the surface-mounted component includes a first bump and a second bump, a cross-sectional area of which in an in-plane direction of a surface facing the mounting component is larger than that of the first bump, on the surface facing the mounting component, the mounting component includes a first pad that is soldered to the first bump and a second pad soldered to the second bump on the surface facing the surface-mounted component, and a ratio of an area of the second pad to the cross-sectional area of the second bump is larger than a ratio of an area of the first pad to the cross-sectional area of the first bump. |
| 申请公布号 |
US2015054178(A1) |
申请公布日期 |
2015.02.26 |
| 申请号 |
US201414466021 |
申请日期 |
2014.08.22 |
| 申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
Ishii Katsumi;Yamaura Masashi |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device comprising:
a surface-mounted component; and a mounting component on which the surface-mounted component is mounted, wherein the surface-mounted component includes a first bump and a second bump, an area of an upper surface of the second bump in an in-plane direction of a surface facing the mounting component is larger than an area of an upper surface of the first bump in an in-plane direction on the surface facing the mounting component, wherein the mounting component includes a first pad soldered to the first bump and a second pad soldered to the second bump on the surface facing the surface-mounted component, and wherein a ratio of an area of a lower surface of the second pad to the area of the upper surface of the second bump is larger than a ratio of an area of a lower surface of the first pad to the area of the upper surface of the first bump. |
| 地址 |
Kyoto JP |
