| 发明名称 |
STRUCTURE |
| 摘要 |
A structure (10) includes: a molded object 2 having a through hole (1); a conduction pattern (3) electrically connecting two surfaces having respective openings of the through hole (1), the conductive body (3) being provided on an inner wall of the through hole (1); and an elastic body (4) being filled in the through hole (1), the elastic body (4) being made of a substance that is deformed by an external pressure more easily than the molded object (2). |
| 申请公布号 |
US2015053473(A1) |
申请公布日期 |
2015.02.26 |
| 申请号 |
US201314387857 |
申请日期 |
2013.07.03 |
| 申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
Okajima Yuhsuke;Takebe Hiroyuki;Katayama Tomofumi |
| 分类号 |
H05K1/02;H05K1/11;H05K1/03 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A structure comprising:
an insulating body having a first through hole; a conductive body electrically connecting two surfaces having respective openings of the first through hole, the conductive body being provided on an inner wall of the first through hole; and a filler being filled in the first through hole, the filler being made of a substance that is deformed by an external pressure more easily than the insulating body. |
| 地址 |
Osaka-shi, Osaka JP |
