BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL)
摘要
Embodiments of the present disclosure are directed towards bumpless interfaces to an embedded silicon die, in integrated circuit (IC) package assemblies. In one embodiment, a method includes forming a surrounding portion of dielectric material defining a cavity therein; placing at least one die in the cavity, the die including a contact; depositing a dielectric material on the die and the surrounding portion; etching the dielectric material to expose the contact; and depositing conductive material onto the contact. Other embodiments may be described and/or claimed.
申请公布号
WO2015026344(A1)
申请公布日期
2015.02.26
申请号
WO2013US56058
申请日期
2013.08.21
申请人
INTEL CORPORATION;TEH, WENG HONG;GUZEK, JOHN S.;SANKMAN, ROBERT L.