发明名称 METHOD FOR PRODUCING MOLDING FOR OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a molding for an optical semiconductor device, which molding can restrain a color of the periphery of an optical semiconductor element from being changed into black in the optical semiconductor device using the molding.SOLUTION: The method for producing moldings 4, 5 for the optical semiconductor device comprises the steps of: transfer-molding a white curable composition, which contains an epoxy compound, an acid anhydride curing agent, a white pigment, and a filler other than the white pigment, and a cure accelerator and has a white color, to obtain an after-cure pre-molding; and performing after-cure treatment on the after-cure pre-molding at the temperature of 155°C or higher and 190 or lower for one or more to five or less hours to obtain the moldings 4, 5 for the optical semiconductor device, each of which moldings has a frame part to be disposed on the lateral side of an optical semiconductor element 3 in an optical semiconductor device 1.
申请公布号 JP2015038180(A) 申请公布日期 2015.02.26
申请号 JP20130193792 申请日期 2013.09.19
申请人 SEKISUI CHEM CO LTD 发明人 SHIKAGE TAKASHI;HIGUCHI ISAO;FUKUDA TAKASHI;YASUI HIDEFUMI;KOBAYASHI YOSHIKI
分类号 C08G59/42;C08K5/09;C08L63/00;H01L33/60;H01L33/62 主分类号 C08G59/42
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