| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip manufacturing method, a circuit board and an electronic apparatus, which can inhibit breakage of a semiconductor chip.SOLUTION: A semiconductor chip manufacturing method comprises: a process of forming surface-side grooves on a surface of a substrate; and a process of forming from a rear side of the substrate, rear face-side grooves which communicate with the surface-side grooves, respectively, by a rotating cutting member having a thickness larger than a width of the surface-side groove to singulate the substrate into semiconductor chips each having a level difference part which is formed by a difference between a width of the surface-side groove and a width of the rear face-side groove. The rear face-side groove is formed by the cutting member having tip shape tapered to the degree higher than that of a tapered range which destroys the level difference part under conditions where the level difference part has such an intensity to be destroyed when a cutting member having a rectangular cross-sectional tip shape when viewed from a rotation direction is used and a range where the thickness center of the cutting member varies in a width direction is included in the width of the surface-side groove. |
