| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a moisture-curable type curable composition which requires no metal compound as a hardening catalyst, e.g. an organic tin compound, and has good quick curability, storage stability, surface curability, adhesiveness and rise of adhesion strength.SOLUTION: A moisture-curable type curable composition comprises an organic polymer containing averagely 0.8 or more cross-linking silicon group, excluding Si-F bonds, in the molecule, (B) a silicon compound having an Si-F bond and (C) a reaction product of a reaction of an amidine with an acid.</p> |
