ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

摘要

The present invention can improve efficiency of a process of forming a via for connecting an electronic component embedded in a substrate to external wiring by including an electronic component having at least one external terminal on at least one surface thereof; a third insulating layer having a second circuit pattern on one surface thereof and a cavity to insert the electronic component therein; a fourth insulating layer provided on the third insulating layer and the electronic component; a first via having one surface in contact with the second circuit pattern through the fourth insulating layer; a second via having one surface in contact with the external terminal through the fourth insulating layer; and a fourth circuit pattern provided on an outer surface of the fourth insulating layer to be in contact with the other surface of the first via and the other surface of the second via.

主权项

1. An electronic component embedded substrate comprising:
an electronic component having at least one external terminal on at least one surface thereof; a third insulating layer having a second circuit pattern on one surface thereof and a cavity to insert the electronic component therein; a fourth insulating layer provided on the third insulating layer and the electronic component; a first via having one surface in contact with the second circuit pattern through the fourth insulating layer; a second via having one surface in contact with the external terminal through the fourth insulating layer; and a fourth circuit pattern provided on an outer surface of the fourth insulating layer to be in contact with the other surface of the first via and the other surface of the second via, wherein the first via and the second via have the same distance from one surface to the other surface.