| 发明名称 |
CARD-TYPE ELECTRONIC COMPONENT COOLING STRUCTURE AND ELECTRONIC DEVICE |
| 摘要 |
A cooling structure for a card-type electronic component, including: a printed circuit board on which a card-type electronic component is detachably mounted; a thermally-conductive heat transfer member, disposed facing the card-type electronic component; a press contact portion that places the heat transfer member in press contact with the card-type electronic component; and a pair of flow path portions that are disposed at both width direction sides of the card-type electronic component, that form flow paths in which coolant flows, and that support the heat transfer member so as to enable heat exchange between the heat transfer member and the coolant. |
| 申请公布号 |
US2015055301(A1) |
申请公布日期 |
2015.02.26 |
| 申请号 |
US201414539026 |
申请日期 |
2014.11.12 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
SO Tsuyoshi;Kubo Hideo;Aoki Nobumitsu;Uzuka Yoshinori |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A cooling structure for a card-type electronic component, comprising:
a printed circuit board on which a card-type electronic component is detachably mounted; a thermally-conductive heat transfer member, disposed facing the card-type electronic component; a press contact portion that places the heat transfer member in press contact with the card-type electronic component; and a pair of flow path portions that are disposed at both width direction sides of the card-type electronic component, that form flow paths in which coolant flows, and that support the heat transfer member so as to enable heat exchange between the heat transfer member and the coolant. |
| 地址 |
Kawasaki-shi JP |
