LIGHT EMITTING MODULE

摘要

According to one embodiment, a light emitting module includes a mounting substrate, a plurality of light emitting chips, a transparent layer, and a phosphor layer. The transparent layer is provided between the plurality of light emitting chips on the mounting face and on the light emitting chip. The transparent layer has a first transparent body and a scattering agent dispersed at least in the first transparent body between the plurality of light emitting chips. The scattering agent has a different refraction index from a refraction index of the first transparent body. The phosphor layer is provided on the transparent layer. The light emitting chip includes a semiconductor layer, a p-side electrode, an n-side electrode, a p-side external terminal, and an n-side external terminal.

主权项

1. A light emitting module, comprising:
a mounting substrate having a mounting face, and a pad provided on the mounting face; a plurality of light emitting chips mounted on the mounting face such that adjacent light emitting chips in the plurality are spaced from each other by a first distance; a transparent layer provided between the plurality of light emitting chips, the transparent layer not including a phosphor, and having a first transparent body and a scattering agent that is dispersed in the first transparent body, the scattering agent having a different refraction index from a refraction index of the first transparent body, the transparent layer spanning the first distance between adjacent light emitting chips in the plurality and directly contacting each adjacent light emitting chip; and a phosphor layer provided on the transparent layer, and having a second transparent body and a phosphor dispersed into the second transparent body, each light emitting chip including:
a semiconductor layer having a first face, a second face opposite to the first face, and a light emitting layer;a p-side electrode provided on the semiconductor layer including the light emitting layer;an n-side electrode provided on the semiconductor layer not including the light emitting layer;a p-side external terminal provided between the p-side electrode and the pad, and electrically connected to the p-side electrode and the pad; andan n-side external terminal provided between the n-side electrode and the pad, and electrically connected to the n-side electrode and the pad.