发明名称 |
SOLDER BUMP FORMATION ON A CIRCUIT BOARD USING A TRANSFER SHEET |
摘要 |
A method of forming solder bumps on electrodes of a circuit board without producing bridging using a solder transfer sheet which does not require alignment includes superposing a circuit board and a solder transfer sheet having a solder layer adhered to at least one side of a supporting substrate, performing heating under pressure to a temperature lower than the solidus temperature of the solder to selectively perform solid phase diffusion bonding of the solder layer to electrodes, and peeling the transfer sheet from the circuit board. The solder layer is in the form of a continuous solder coating or in the form of a monoparticle layer of solder particles which are adhered to the supporting substrate by an adhesive layer. |
申请公布号 |
EP2398305(A4) |
申请公布日期 |
2015.02.25 |
申请号 |
EP20100741308 |
申请日期 |
2010.02.15 |
申请人 |
SENJU METAL INDUSTRY CO., LTD |
发明人 |
KURAMOTO TAKEO;TSURUTA KAICHI;SAITOU TAKEO |
分类号 |
H05K3/34;B23K1/00;B23K1/20;B23K3/06;B23K35/26;C22F1/00;H01L21/48;H01L21/60;H01L21/683 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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