发明名称 配線基板の製造方法及び配線基板
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board with which a contact hole is made in a productive and reliable manner at a low cost. <P>SOLUTION: A first electrode 3 and a second electrode 7 are formed on a first board 1. A contact hole 2 is formed by forming a conductive film 9 on the side wall and the bottom of a fine hole formed so that the first electrode 3 and the second electrode 7 communicate with each other. When the wiring board 100 is manufactured, in the fine hole forming process to form the fine hole, a first groove region 4 made of relatively shallow grooves is formed on the opening end side of the side wall of the fine hole, and a second groove region 5 made of relatively deep grooves is formed on the bottom side of the side wall of the fine hole. To form the conductive film 9, a liquid containing a conductive material is added to the second groove region 5 out of these divided groove regions 4 and 5. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5676941(B2) 申请公布日期 2015.02.25
申请号 JP20100153681 申请日期 2010.07.06
申请人 发明人
分类号 H01L21/3205;H01L21/3065;H01L21/768;H01L23/522 主分类号 H01L21/3205
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