| 摘要 |
<p>A vertical probe card for micro bump probing includes a contact part which is electrically connected to a fine bump of a circuit device, a transmission unit which is formed in an opposite side of the contact part to interface an electrical signal generated according to an electrical contact between the contact part and the fine bump on a substrate which is arranged on the upper side, and a connection unit which is formed with a vertical pillar structure with a connection part to connect the contact part to the transmission unit, and a protrusion part which to make the edge part of the contact part protrude from the surface of the vertical pillar structure to the fine bump in the end of the contact part.</p> |
