发明名称 真空処理装置内の基板の温度を測定するための方法及びデバイス
摘要 A method and device for determining temperature of a substrate in a vacuum processing apparatus during a process of the substrate are disclosed, the substrate to be measured is placed on a susceptor in the vacuum processing apparatus for a manufacture process, and the method includes: selecting i wavelengths from radiance emitted from the susceptor through a substrate, where i is a natural number greater than 1; obtaining at least i pieces of radiance corresponding to the selected i wavelengths; and calculating the temperature of the substrate based on the i pieces of radiance and the i wavelengths, by using a mathematical equation: E(lambdai)=T(d)×M(lambdai,T), where E(lambdai) is the ith radiant quantity corresponding to the ith wavelength lambdai, T(d) is transmittance of the substrate, which is a function of thickness d of a film grown on the substrate, and M(lambdai,T) is blackbody radiation equation, which is a function of the ith wavelength lambdai and the substrate temperature T.
申请公布号 JP5676682(B2) 申请公布日期 2015.02.25
申请号 JP20130096785 申请日期 2013.05.02
申请人 发明人
分类号 H01L21/205;C23C16/52;G01J5/00;H01L21/3065;H01L21/365 主分类号 H01L21/205
代理机构 代理人
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