发明名称 SEMICONDUCTOR DEVICE
摘要 In order to inhibit a crack under a pad opening without increasing a chip size, a protective film (6) includes a pad opening (9) that exposes a part of a topmost layer metal film (3). The pad opening (9) is rectangular and square, and has an opening width of d0. A second metal film (2) has an opening under the pad opening (9). The opening is rectangular and square, and has an opening width of d4. A distance between an opening edge of the protective film (6) and an opening edge of the second metal film (2) is d3. The second metal film (2) has a rectangular donut shape, and protrudes to an inner side of the pad opening (9) by the distance d3.
申请公布号 KR20150020313(A) 申请公布日期 2015.02.25
申请号 KR20147035015 申请日期 2013.05.21
申请人 发明人
分类号 H01L23/00;H01L23/498;H01L23/522 主分类号 H01L23/00
代理机构 代理人
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