| 摘要 |
The present invention relates to the field of chip packaging technologies and provides a chip stacking packaging structure, so as to achieve high-density stacking, and improve a heat dissipation efficiency of the chip stacking packaging structure. A chip stacking packaging structure includes a main substrate and at least one stacking substrate, where a main chip is disposed in the main substrate, and at least one stacking chip is disposed on the stacking substrate; and a side edge of the stacking substrate is disposed on the main substrate, so that the stacking chip is connected to the main chip. |
