发明名称 電気めっき装置
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electroplating apparatus which hardly produces a knob-like or dendritic plated metal crystal on the surface of a metal belt and, moreover, and can perform electroplating treatment so as to secure high adhesiveness between a plating layer and the metal belt. <P>SOLUTION: The electroplating apparatus 10 includes: an electrolyzer 2; a feeding mechanism 3 which causes the metal belt S to pass in the electrolyzer 2; a passage mechanism 5 which causes plating liquid to pass in the plate-passing direction (X3 direction) or the direction (X4 direction) reverse to the plate-passing direction of the metal belt S in the electrolyzer 2; and a pair of electrodes 1A, 1B arranged on positions which hold the metal belt S therebetween, wherein both of the pair of electrodes 1A, 1B have alternatively protruded parts 1b and recessed parts 1a on the positions corresponding to each other and in the plate passing direction, inter-electrode distances are shortened between the protrusion parts 1b, 1b of both electrodes, the inter-electrode distances are lengthened between the recessed parts 1a, 1a of both electrodes and the recessed parts 1a', 1a' having the longest length in the plate-passing direction are arranged on the input side end part into which the metal belt S enters. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5676329(B2) 申请公布日期 2015.02.25
申请号 JP20110064414 申请日期 2011.03.23
申请人 发明人
分类号 C25D17/12 主分类号 C25D17/12
代理机构 代理人
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