| 摘要 |
<p>According to the present invention, a vinyl shrinking apparatus to package a special gas tank to manufacture a semiconductor comprises: a supporting frame on which the special gas tank is mounted; an elevating frame arranged to face the special gas tank, and installed to be able to be moved up or down along the supporting frame; a motor supplying power to move the elevating frame up or down; a power transmitting part converting the power supplied from the motor, and transmitting the converted power to move the elevating frame up or down; and a heating part installed in the elevating frame heating vinyl covered on the special gas tank such that the vinyl can adhere to the special gas tank. According to the present invention, the vinyl shrinking apparatus is capable of preventing an air layer from being generated in the packaging vinyl when shrinking the vinyl covered on the special gas tank, and is capable of reducing the time required to shrink the vinyl.</p> |
