| 发明名称 |
SINGLE-CHIP MULTI-DOMAIN GALVANIC ISOLATION DEVICE AND METHOD |
| 摘要 |
<p>An integrated circuit, including: at least three integrated circuit portions mutually spaced on a single electrically insulating die, the integrated circuit portions being mutually galvanically isolated; and signal coupling structures on the die to allow communication of signals between the integrated circuit portions while maintaining the galvanic isolation therebetween.</p> |
| 申请公布号 |
EP2839583(A1) |
申请公布日期 |
2015.02.25 |
| 申请号 |
EP20130778241 |
申请日期 |
2013.04.17 |
| 申请人 |
THE SILANNA GROUP PTY LTD |
发明人 |
MOGHE, YASHODHAN, VIJAY;TERRY, ANDREW |
| 分类号 |
H03M1/02;B82Y25/00;H01F19/04;H01L21/762;H01L21/768;H01L23/522;H01L23/538;H01L27/00;H01L27/02;H01L29/06;H03K17/16;H03M1/08;H03M1/12;H03M1/66;H04B1/40;H04J3/04 |
主分类号 |
H03M1/02 |
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