| 摘要 |
<p>An object is to provide a polishing liquid composition that can provide hydrophilicity to a wafer surface and effectively improve a haze in polishing of wafers for substrates in electronics industry. The present invention is a polishing liquid composition for wafers, comprising: water; silica particles; an alkaline compound; a polyvinyl alcohol; an anion-modified polyvinyl alcohol; and a surfactant, wherein the mass ratio of the anion-modified polyvinyl alcohol to the polyvinyl alcohol is 0.6 to 5.5. The anion-modified polyvinyl alcohol is preferably a polyvinyl alcohol modified with a carboxy group or a sulfonic acid group.</p> |
