| 摘要 |
<p>The technical object of the present invention is to provide a semiconductor with a support stand of a high open ratio for smoothly performing a post-process and preventing a cylindrical structure like cylindrical bottom electrodes from falling and a manufacturing method thereof. The semiconductor device includes a plurality of cylindrical structures with honeycomb structures and the integrated support stand which includes a plurality of open regions to open four cylindrical structures. The open region has a parallelogram or elliptical structure. The distance of a segment to link two cylindrical structures which face each other in a shortest distance among four cylindrical structures which are opened by the open region corresponds to a distance between the central point and the vertex.</p> |
