THERMALLY CONDUCTIVE POLYMER COMPOSTIONS TO REDUCE MOLDING CYCLE TIME

摘要

A thermally conductive polymer composition comprising (1) a polymer material, and (2) a thermally conductive filler. The thermally conductive filler can be boron nitride. The thermally conductive polymer composition can be used in a molding operation to form a molded article and can reduce the molding cycle time of a molding process. In one embodiment, increasing the thermal conductivity of a polymer material (as compared to the thermal conductivity of the material in the absence of a thermally conductive filler) increases the thermal diffusivity and reduces the cooling time of the article. The present invention also provides methods of forming molded articles from such compositions.