| 摘要 |
The present invention provides a semiconductor package with reliability. The semiconductor package according to the present invention includes a substrate which includes a bottom plate and a top plate; a semiconductor chip which is arranged on the upper side of the substrate; and a mold layer which surrounds the bottom side and the sidewall of the semiconductor chip. The substrate includes: an inner path which extends between the bottom plate and the top plate and a mold path which includes a mold hole which is connected to the inner path by passing through the top plate. The mold layer extends to the inside of the inner path through the mold hole. |
