| 摘要 |
<p>According to an embodiment of the present invention, disclosed is a thin film encapsulation manufacturing apparatus which includes a first transfer chamber for aligning a substrate which is inputted from the outside or is processed at each process; a sputtering chamber which is connected to the first transfer chamber and forms a first inorganic layer by a sputtering process; a monomer deposition chamber which is connected to the first transfer chamber and deposits a first organic layer on the first inorganic layer; a chemical vapor deposition chamber which is connected to the first transfer chamber and forms a second inorganic layer on the first organic layer; and an atomic layer deposition (ALD) chamber which is connected to the first transfer chamber and forms a third inorganic layer on the second inorganic layer.</p> |
