| 摘要 |
<p>The present invention relates to an apparatus for bonding a large-sized substrate, in which resin is uniformly spread on the large-sized substrate to the edge of the large-sized substrate without bubble generation when the large-sized substrate is bonded with the other substrate. According to the present invention, the apparatus for bonding a large-sized substrate includes: an upper substrate adsorption part which adsorbs an upper substrate in a convex-downward state; a rotation driving part which rotates and drives the upper substrate adsorption part; a vertical driving part which drives the upper substrate adsorption part and the rotation driving part up and down; a lower substrate adhesion part which adsorbs a lower substrate in a plane state; and a horizontal moving part which moves the lower substrate adsorption part horizontally.</p> |
