Examples of integrated sensors are disclosed herein. An example of an integrated sensor includes a substrate and a sensing member formed on a surface of the substrate. The sensing member includes collapsible signal amplifying structures and an area surrounding the collapsible signal amplifying structures that enables self-positioning of droplets exposed thereto toward the collapsible signal amplifying structures.
申请公布号
EP2839295(A1)
申请公布日期
2015.02.25
申请号
EP20120874752
申请日期
2012.04.20
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人
BRATKOVSKI, ALEXANDRE M.;LI, ZHIYONG;WU, WEI;HU, MIN;WILLIAMS, R. STANLEY;KIM, ANSOON