发明名称 Micro-fluidic package
摘要 The present invention relates to a micro-fluidic chip having a novel structure, wherein a micro-fluidic chip is packaged using a micro-lead frame to be able to output electric signals and is packaged in a structure in which an analysis target material injecting space is formed. In the present invention, the micro-fluidic chip is installed on the micro-lead frame to be able to be conducted. The installed micro-fluidic chip is molded with a molding compound resin to be protected. A channel or a chamber for exposing the surface of the micro-fluidic chip to the molding compound resin is indirectly formed, so that an analysis target material is flowed into or sealed in the indirectly formed channel or chamber. Accordingly, the analysis target material of the micro-fluidic chip can be actively analyzed, and the micro-fluidic chip can be strongly protected.
申请公布号 KR20150018945(A) 申请公布日期 2015.02.25
申请号 KR20130095147 申请日期 2013.08.12
申请人 发明人
分类号 B32B37/02;G01N27/00;G01N33/48;G01N35/08 主分类号 B32B37/02
代理机构 代理人
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