Pixel via and methods of forming the same

摘要

This disclosure provides systems, methods and apparatuses for pixel vias. In one aspect, a method of forming an electromechanical device having a plurality of pixels includes depositing an electrically conductive black mask on a substrate at each of four corners of each pixel, depositing a dielectric layer over the black mask, depositing an optical stack including a stationary electrode over the dielectric layer, depositing a mechanical layer over the optical stack, and anchoring the mechanical layer over the optical stack at each corner of each pixel. The method further includes providing a conductive via in a first pixel of the plurality of pixels, the via in the dielectric layer electrically connecting the stationary electrode to the black mask, the via disposed at a corner of the first pixel, offset from where the mechanical layer is anchored over the optical stack in an optically non-active area of the first pixel.

主权项

1. A device, comprising:
an array of pixels, each pixel including:
a substrate;an electrically conductive black mask disposed on the substrate and masking an optically non-active portion of the pixel at each of four corners of the pixel;a dielectric layer disposed over the black mask;an optical stack disposed over the dielectric layer, the optical stack including a stationary electrode; anda mechanical layer positioned over the optical stack and defining a cavity between the mechanical layer and the optical stack, the mechanical layer movable through the cavity between an actuated position and a relaxed position, the mechanical layer anchored over the optical stack at each corner of the pixel; wherein the array of pixels includes a first pixel having a conductive via in the dielectric layer electrically connecting the stationary electrode to the black mask, the via disposed at a corner of the first pixel offset from where the mechanical layer is anchored over the optical stack in an optically non-active area of the first pixel.