发明名称 |
Method for manufacturing organic light emitting diode display |
摘要 |
A method of manufacturing an organic light emitting diode (OLED) display according to an exemplary embodiment includes: forming a display unit displaying an image and a driver positioned near the display unit to drive a light emitting element of the display unit in a lower mother substrate; forming a sealant and a plurality of bumps in an upper mother substrate; aligning the lower mother substrate and the upper mother substrate to face each other; melting and hardening the sealant to combine the lower mother substrate and the upper mother substrate; cutting the upper mother substrate; and cutting the lower mother substrate, wherein the cutting of the upper mother substrate is performed according to a first cutting line between the sealant and the bumps and a second cutting line corresponding to the bumps. |
申请公布号 |
US8962357(B2) |
申请公布日期 |
2015.02.24 |
申请号 |
US201313828813 |
申请日期 |
2013.06.28 |
申请人 |
Samsung Display Co., Ltd. |
发明人 |
Park Dong-Seop |
分类号 |
H01L21/00;H01L51/56;H01L21/56;H01L51/52 |
主分类号 |
H01L21/00 |
代理机构 |
Christie, Parker & Hale, LLP |
代理人 |
Christie, Parker & Hale, LLP |
主权项 |
1. A method of manufacturing an organic light emitting diode (OLED) display, the method comprising:
forming a display unit, which is for displaying an image, and a driver, which is positioned near the display unit to drive a light emitting element of the display unit, on a lower mother substrate; forming a sealant and a plurality of bumps on an upper mother substrate; aligning the lower mother substrate and the upper mother substrate to face each other; melting and hardening the sealant to attach the lower mother substrate to the upper mother substrate; cutting the upper mother substrate; and cutting the lower mother substrate, wherein the cutting of the upper mother substrate is performed along a first cutting line, which is between the sealant and the bumps, and along a second cutting line corresponding to the bumps. |
地址 |
Yongin-si KR |