发明名称 Method for manufacturing organic light emitting diode display
摘要 A method of manufacturing an organic light emitting diode (OLED) display according to an exemplary embodiment includes: forming a display unit displaying an image and a driver positioned near the display unit to drive a light emitting element of the display unit in a lower mother substrate; forming a sealant and a plurality of bumps in an upper mother substrate; aligning the lower mother substrate and the upper mother substrate to face each other; melting and hardening the sealant to combine the lower mother substrate and the upper mother substrate; cutting the upper mother substrate; and cutting the lower mother substrate, wherein the cutting of the upper mother substrate is performed according to a first cutting line between the sealant and the bumps and a second cutting line corresponding to the bumps.
申请公布号 US8962357(B2) 申请公布日期 2015.02.24
申请号 US201313828813 申请日期 2013.06.28
申请人 Samsung Display Co., Ltd. 发明人 Park Dong-Seop
分类号 H01L21/00;H01L51/56;H01L21/56;H01L51/52 主分类号 H01L21/00
代理机构 Christie, Parker & Hale, LLP 代理人 Christie, Parker & Hale, LLP
主权项 1. A method of manufacturing an organic light emitting diode (OLED) display, the method comprising: forming a display unit, which is for displaying an image, and a driver, which is positioned near the display unit to drive a light emitting element of the display unit, on a lower mother substrate; forming a sealant and a plurality of bumps on an upper mother substrate; aligning the lower mother substrate and the upper mother substrate to face each other; melting and hardening the sealant to attach the lower mother substrate to the upper mother substrate; cutting the upper mother substrate; and cutting the lower mother substrate, wherein the cutting of the upper mother substrate is performed along a first cutting line, which is between the sealant and the bumps, and along a second cutting line corresponding to the bumps.
地址 Yongin-si KR
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