发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
A ferroelectric capacitor formed above a semiconductor substrate includes a lower electrode, a dielectric film (ferroelectric film) having ferroelectric characteristics, and an upper electrode. The upper electrode includes a conductive oxide film made of a ferroelectric material to which conductivity is provided by adding a conductive material such as Ir, and the conductive oxide film is in contact with the dielectric film. |
申请公布号 |
US8962347(B2) |
申请公布日期 |
2015.02.24 |
申请号 |
US201113301396 |
申请日期 |
2011.11.21 |
申请人 |
Fujitsu Semiconductor Limited |
发明人 |
Wang Wensheng |
分类号 |
H01L21/00;H01L27/115;H01L49/02 |
主分类号 |
H01L21/00 |
代理机构 |
Fujitsu Patent Center |
代理人 |
Fujitsu Patent Center |
主权项 |
1. A method of manufacturing a semiconductor device, the method comprising:
forming a lower electrode film above a semiconductor substrate; forming a dielectric film made of a ferroelectric material on the lower electrode film by a sputtering method; subjecting the dielectric film to a crystallization treatment; and forming a conductive oxide film on the dielectric film, the conductive oxide film being made of a ferroelectric material to which conductivity is provided by adding a conductive material, wherein the ferroelectric material forming the conductive oxide film is PZT, the conductive material is at least one of iridium and ruthenium, and a percentage content of the conductive material in the ferroelectric material forming the conductive oxide film is not less than 1 mol % and not more than 4 mol %, and the forming the lower electrode film includes:
forming a noble metal film made of a noble metal above the semiconductor substrate; andforming an amorphous noble metal oxide film, made of an oxide of a noble metal that is the same as the noble metal forming the noble metal film, on the noble metal film, a film thickness of the noble metal oxide film being equal to or more than 0.1 nm and equal to or less than 3 nm. |
地址 |
Yokohama JP |