Method of manufacturing a printed circuit board having an embedded electronic component

摘要

A method of manufacturing a core substrate having an electronic component, including providing a core substrate having a first surface and a second surface on an opposite side of the first surface, forming a through hole extending from the first surface to the second surface in the core substrate, attaching an adhesive tape to the second surface of the core substrate such that the through hole formed in the core substrate is closed on the second surface, attaching an electronic component to the adhesive tape inside the through hole, filling the through hole with a filler, and removing the adhesive tape from the second surface of the core substrate.

主权项

1. A method of manufacturing a printed circuit board having an embedded electronic component, comprising:
providing a core substrate having a first surface and a second surface on an opposite side of the first surface; forming a through hole extending from the first surface to the second surface in the core substrate; attaching an adhesive tape to the second surface of the core substrate such that the through hole formed in the core substrate is closed on the second surface; attaching an electronic component having a plurality of electrodes to the adhesive tape inside the through hole; supplying a filler to a space formed in the through hole having the electronic component positioned inside the through hole such that the filler fills the space in the through hole and the electronic component is embedded in the filler; removing the adhesive tape from the second surface of the core substrate; and forming a buildup structure on the second surface of the core substrate, wherein the buildup structure includes an interlayer insulating layer and a conductor circuit formed on the interlayer insulating layer of the buildup structure.