Surface properties of polymeric materials with nanoscale functional coating

摘要

A film deposition process comprising exposing a surface of a substrate to a first plasma treatment having plasma reactants in a plasma chamber to form an activated substrate surface. The activated surface has a lower water contact angle than the substrate surface before the surface activating. The process comprises introducing water vapor into the plasma chamber to form a water layer on the activated surface. The process comprises introducing pre-cursors molecules into the plasma chamber in the presence of a second plasma to graft a layer of reacted pre-cursor molecules on the water layer.

主权项

1. A film deposition process, comprising:
exposing a surface of a substrate to a first plasma treatment having plasma reactants in a plasma chamber to form an activated substrate surface, wherein the activated surface has a lower water contact angle than the substrate surface before the surface activation; removing the plasma reactants from the plasma chamber; and then introducing water vapor into the plasma chamber to form a water layer bonded to the activated surface; and then introducing pre-cursors molecules into the plasma chamber in the presence of a second plasma treatment to graft a layer of reacted pre-cursor molecules to molecules of the water layer such that the molecules of the water layer form a bonding link between the substrate surface and the reacted pre-cursor molecules, wherein the second plasma treatment includes a plasma chamber pressure that is in a range from 100 mTorr to 500 mTorr.